Photo 1 – External cracked package observed at Gate and Source lead of device #1.

Photo 2 - External cracked package observed at Gate and Source lead of device #2.

Photo 3 – External cracked package observed at Gate lead of device #3 (visible only at high power microscopic inspection).

Photo 4 – External cracked package observed at Source lead of device #3 (visible only at high power microscopic inspection).

Photo 5 – Electrical burnt defect observed at Gate bond area of unit #1.

Photo 6 – Electrical burnt defect observed at Gate bond area of unit #2.

Photo 7 – Electrical burnt defect observed at Gate bond area of unit #3.