• Heat fused vinyl composite
  With top and bottom dissipative vinyl layers and conductive grid mesh inner layer
• Material resists delamination
  Reduces unintended alternative ground paths
• Compatible for use with continuous monitors
• Conductive grid mesh inner layer
  Provides consistent, reliable, and defined grounding path
• Dissipative cushioned vinyl bottom layer
  Provides energy absorption for components susceptible to physical shock like disk drives
• Abrasion resistant top layer for long life, saves money
• Meets ESD worksurface required limit of ANSI/ESD S20.20 and recommendation of ANSI/ESD S4.1
• RTT: 10⁶ - 10⁸ ohms per ANSI/ESD S4.1
• RTG: 10⁶ - 10⁸ ohms per ANSI/ESD S4.1-1997
• Charge Decay: <0.01 sec. per EIA-541
• Thickness: 0.125" (3.2mm)
• Lead-free RoHS compliant
• Made in America

"The most important functional consideration for worksurfaces is the RTG resistance from the top of the surface to the groundable point." ANSI/ESD S20.20 Table 1 recommends a requirement of less than 1 X 10^9 ohms. "If Charged Device Model damage is a concern then setting a lower resistance limit should be considered. Typically, 1 x1 0^6 ohms." "Durability factors that should be considered are hardness, abrasion resistance, tear resistance, etc. Worksurfaces may require special heat resistant materials. Light reflection may be an important ergonomic consideration." (Ref: TR 20.20 section 5.3.1).

Due to variations in computer monitor displays, color shown may not be exact.  For true accurate color, please email Service@ESDSystems.com to request an actual sample.